Introduction

The synergy between Intelligent Computation and Large Language Models (LLMs) has become a core driving force advancing artificial intelligence, enabling LLMs to break through bottlenecks in efficiency, reasoning, and practical deployment through advanced intelligent computing technologies. This track focuses on the latest theoretical breakthroughs, algorithmic innovations, and practical applications at the intersection of intelligent computation and LLMs. It aims to gather global academic achievements and industrial practices addressing key challenges such as efficient computation for large-scale models, enhanced reasoning mechanisms, and reliable deployment of LLM-based intelligent systems.

Topics

• Efficient Intelligent Computation for LLMs
• Intelligent Computation-Enhanced LLM Reasoning
• Long-Context Processing and Memory-Augmented Computation for LLMs
• Edge-Aware Intelligent Computation for LLMs
• Industrial Applications of Intelligent Computation-Enhanced LLMs

Important Dates

• Submission Deadline: February 15, 2026 (1st round), March 30, 2026 (2nd round)
• Notification of Acceptance: March 15, 2026 (1st round), April 10, 2026 (2nd round)
• Camera-Ready Deadline: April 15, 2026
• Conference Dates: May 8–10, 2026

Awards

ICI 2026 will present Best Paper, Best Student Paper, and Outstanding Contribution awards. All accepted papers will be considered based on originality, technical depth, presentation quality, and research impact.

Manuscript Guidelines

• Papers must be clearly presented in English, not exceed 14 pages  in Springer LNCS format.
• All accepted papers will be published by Springer  and will be indexed by EI Compendex. 
• Submit in PDF format via: https://easychair.org/conferences/?conf=ici2026
• Distinguished papers will be recommended to special issues of selected journals:

1. 1. IEEE Transactions on Consumer Electronics (SCI)
   2. Applied Sciences-Basel (SCI)
   3. 通信学报
   4. International Journal of Embedded Systems (EI)
   5. International Journal of Computational Science and Engineering (EI)

We warmly welcome your submissions and look forward to your participation in ICI 2026 in beautiful Zhuhai, China