Introduction

Natural Language Processing (NLP) and Multimodal Technologies are core pillars driving the advancement of artificial intelligence, enabling machines to understand, generate, and interact with human language and multi-dimensional data in a more natural and intelligent way. This track focuses on the latest theoretical innovations, algorithmic breakthroughs, and practical applications at the intersection of NLP and multimodal technologies. It aims to gather global academic achievements and industrial practices addressing key challenges such as cross-modal alignment, multimodal fusion, and efficient multimodal model deployment. 

Topics

• Cross-Modal Alignment and Fusion for NLP
• Multimodal Large Language Models (MLLMs)
• NLP-Powered Multimodal Content Understanding
• Multimodal Generation and Creation
• Industrial Applications of NLP and Multimodal Technologies

Important Dates

• Submission Deadline: February 15, 2026 (1st round), March 30, 2026 (2nd round)
• Notification of Acceptance: March 15, 2026 (1st round), April 10, 2026 (2nd round)
• Camera-Ready Deadline: April 15, 2026
• Conference Dates: May 8–10, 2026

Awards

ICI 2026 will present Best Paper, Best Student Paper, and Outstanding Contribution awards. All accepted papers will be considered based on originality, technical depth, presentation quality, and research impact.

Manuscript Guidelines

• Papers must be clearly presented in English, not exceed 14 pages  in Springer LNCS format. (Template: https://ici2026.intelligence-conf.com/Manuscript_Templates_ICI2026.zip)
• All accepted papers will be published by Springer  and will be indexed by EI Compendex. 
• Submit in PDF format via: https://easychair.org/conferences/?conf=ici2026
• Distinguished papers will be recommended to special issues of selected journals:

1. 1. IEEE Transactions on Consumer Electronics (SCI)
   2. Applied Sciences-Basel (SCI)
   3. 广州大学学报
   4. 通信学报
   5. International Journal of Embedded Systems (EI)
   6. International Journal of Computational Science and Engineering (EI)

We warmly welcome your submissions and look forward to your participation in ICI 2026 in beautiful Zhuhai, China